BTE Internal Components

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	1. Microphones	New microphone design is less prone to shock and feedback-related problems Microphone diaphragms are perpendicular to receiver diaphragm, eliminating sympathetic vibrations that can cause feedback Microphones are offset from port openings, reducing the potential for moisture problems
	2. Receiver	Filterless receiver is less susceptible to shock and moisture damage New receivers provide a smoother frequency response, resulting in better sound quality
	3. DSP Chip	Newest generation of SONIC's patented multiplicative AGC processing and envelope mapping resulting in unprecedented sound quality Uses efficient FFT+Finite Impulse Response processing, resulting in lower battery consumption Group time delay of <6ms, providing real-time processing of sound Dual A/D converters allow for multiple omni microphone directionality E2 memory size increased 14,000% over previous SOIC DSP, allowing for implementation of more complex features
	4. Telecoil	Calibrated to match the omni microphone response New telecoil design reduces electro-magnetic interference and "hum"(60 cycle).